FASTPCBA Co., Ltd.
FASTPCBA Is Professional 20 Years PCB / PCBA Manufactuer, Supply One-Stop Solution: PCB Manufacturing + Components Sourcing + PCB Assembly + Testing.
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FASTPCBA is the high tech pcb factory in china over 20 years, our pcba service feature: middle and small batch quick pcb prototype, turnkey pcb assembly, high quality custom pcba manufacturing, original package components procurements etc.
With complete dust free & esd protection smt workshop, FASTPCBA has win trust and support from domestic and abroad customers of industrial control, medical,power communication, automotive etc. All pcba products here abide by IATF16949 & ISO14000 & ISO13485 & ISO9001 certificates, reliable and stable pcb manufacturing and assembly service are assured.
FASTPCBA believes quality derives from profession, reputation wins the future. From grass-roots employees to senior management all concentrate on precise and high quality pcba solutions to provide better service for customers.
Material FR-4(Standard FR4,Mid-Tg,FR4,Hi-Tg,FR4,Lead free assembly material),
Halogan-Free,Ceramic filed,,Polyimide,BT,PPO,PPE,Hybrid,Partial hybrid,etc.
Min.idth/Spacing Inner layer:3mil/3mil(HOZ),Outer
Max Copper Thickness
UL certificated:6.0OZ/Pilot run:12OZ
Min.Hole Size
Mechanical drill:8mil(0.2mm) Laser drill:3mil(0.075mm)
Aspect Ratio 18:01:00
Surface Finishing ENIG
Special Process Buried Hole,Blind Hole,Embedded Resistance,Embedded Capacity,Hybrid,Partial hybrid,Partial high density,Back drilling,and Resistance control.
| OEM Services: | |||
| Layers | 1-48 layers | Min. line width | 2mil |
| Max.board size (single&doule sided) | 700*1200mm | Min.annular ring width: vias | 3mil |
| Surface finish | HAL(with Pb free),plated Ni/Au, Immersion silver,Imm Ni/Au,Imm Sn, hard gold,OSP,ect | Min.board thickness(multilayer) | 4layers:0.4mm; 6layers:0.6mm; 8layers:1mm; 10layers:1.2mm |
| Board materials | FR4; high Tg; high CTI; halogen free; high frequency(rogers,taconic, PTFE,nelcon, ISOLA,polyclad 370 HR); thick copper | Plating thickness (Technique: Immersion Ni/Au) | Plating type: Imm Ni, Min./Max thickness:100/150U'' Plating type: Imm Au, Min./Max thickness:2/4U'' |
| Impedance control | ± 10% | Distance between line to board edge | Outline: 0.2mm V-CUT: 0.4mm |
| Base copper thickness(Inner and outer layer) | Min. thickness:1/3 OZ Max.thickness:6OZ | Min.hole size(board thickness ≥2mm) | Aspect ratio≤16 |
| Finished copper thickness | Outer layers: Min.thickness 1OZ, Max.thickness 10 OZ Inner layers: Min.thickness 0.5OZ, Max.thickness 6 OZ | Max.board thickness(single&doule sided) | 6mm |
